Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first, technology as the core, and customer demand as the orientation, focusing on the high-end segmented circuit board market covering an area of approximately 10000 square meters.

The company's products are widely used in communication, new energy, industrial control, consumer electronics, automotive electronics and medical electronics and other application fields, and the products serve well-known customers at home and abroad.

• With up to 14 layer any layer capability
• Min line width and spacing in volume production is around 40μm
• Fine pitch BGA with 0.35mm
• Capability of plated copper or filled with conductive paste for stacked microvias
• Heavy Copper, embedded coin and provide a thermal management solution
• Support planar surface for ball grid array ("BGA") (Via-in-Pad) Enhance impedance performance
• Enhance impedance performance
• Microvias solutions for Radio Frequency HDI boards
• High speed material for hybrid HDI
• Wide range laminate support (Low Tg , high Tg material and halogen free material )
• Low-DK laminate for smart devices
• Signal integrity enhancement
• Edge plating capability
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• Your inquiry will be replied within 12 hours
• Well-trained & experienced sales can reply your inquiries in English
• During working time, E-mail will be replied to you within 2 hours
• OEM & ODM projects are highly welcomed, we have strong R&D team
• The order will be produced exactly according to order details and proofed samples, our QC will submit inspection report before shipment
• Your business relationship with us will be confidential to any third party
• Good after-sale service